? Product Information: 1, mainly used in integrated circuit manufacturing processes Photo, DIFF, WET / Etch, Eglass, Nickel and other processes for 2 to 12-inch wafer processing; ??? 2, the main process: according to customers' requirements, the use of HF / HNO3 / HCL? /? H3PO4 / H2SO4 /? SC1 / SC2 / H2SO4 / NMP / BOE and other liquid, combined with ultrasound, throwing, circulating filtration, heating, mechanical transmission, automatic dosing, rehydration and other functions, effective removal of metal ions, particles, glue and other dirt on silicon, so as to achieve the desired effect; ??? 3, control:? manual, semi-automatic; ??? 4, Material:? According to customer and process requirements selection, optional PP, PVC, PVDF, PTFE, quartz, SUS and other materials. Features and Benefits: modular design; according to your process and needs to provide you with a special design; customized according to the customer's budget; optimal cleaning process technology programs; cost-effective; many modules for the election; user-friendly interface; safety and environmental protection; easy maintenance; non-standard products according to your specific needs are welcome detailed advice! ?